Industrial solutions
for printed electronics
for printed electronics
Our Solution
Thanks to our high volume manufacturing process, we meet printed industry needs which require flexible copper-based electronic circuits.
Additive
technology
Our copper-based EOPROM® formulation promotes adhesion
on any plastic substrate that allows metal deposits. Low environmental footprint technology. We deposit our Eoprom only on the dedicated areas.
Flexible
materials
Our EOPROM® paste provides excellent adhesion to all thermoplastic and thermoset substrates as well as flexible plastics including glass fibers for smart composite manufacturing.
Metallization of plastics
and composites
The EOPROM® paste is a precursor to the metallization of plastics, so various metals can be deposited, in particuliar copper but also nickel, tin, silver and gold.
Applications
- Composites
- Field of IoT
- Heating circuits
- Manufacture of flexible antennas
- Medical applications
Our Products
EOPROMFLEX®
R2R process developed by MCVE Technologie which uses the EOPROM® paste for high volume industrial manufacturing.
EOPROM® Paste
Formulation patented by MCVE Technologie allows very good adhesion on all plastic materials with metallization possibilities.
Do you have any questions ?
or wanting to know more about us ?