Industrial solutions
for printed electronics
Our Solution

Thanks to our high volume manufacturing process, we meet printed industry needs which require flexible copper-based electronic circuits.


Our copper-based EOPROM® formulation promotes adhesion on any plastic substrate that allows metal deposits. Low environmental footprint technology. We deposit our Eoprom only on the dedicated areas.


Our EOPROM® paste provides excellent adhesion to all thermoplastic and thermoset substrates as well as flexible plastics including glass fibers for smart composite manufacturing.

Metallization of plastics
and composites

The EOPROM® paste is a precursor to the metallization of plastics, so various metals can be deposited, in particuliar copper but also nickel, tin, silver and gold.
Play Video


Our Products


R2R process developed by MCVE Technologie which uses the EOPROM® paste for high volume industrial manufacturing.


Formulation patented by MCVE Technologie allows very good adhesion on all plastic materials with metallization possibilities.
Do you have any questions ?
or wanting to know more about us ?