EOPROMFLEX®
R2R (Roll to Roll) and S2S (Sheet To Sheet) processes which allow the industrial production of high-volume of additive flexible electronic circuits using EOPROM® paste.
The use of metallization baths in the EOPROMFLEX® process makes it possible to modulate the final conductivity of the material and therefore broadens the fields of application of the final product (antennas, electronic circuits, connectors, heating, electromagnetic shielding…).
Advantages
- Energy efficient : uses less energy (per unit area of roll manufactured) than conventional manufacturing processes
- Development of a new ecosystem for low cost additive flexible circuits
- Modular process according to different flexible substrates (plastics, fabrics)
EOPROM® Paste
Formulation developed and patented by MCVE Technologie which allows a very good adhesion on any plastic and composite substrate, without any specific preparation of the substrate, with galvanic
metallization properties.
Technical specifications
- Copper-based paste of micrometric size
- Adhesion ISO 0 (ISO2409 norm) on PC, PI, PET, PPE, ABS, PA, Corian®, FR4, glass fiber, ceramic, certain PP and some resins
- Precursor to metallization
- Industrial cost of high volume manufacturing
- Dispensing, silk-screening or spraying
- Can be sprayed for electrostatic painting and electromagnetic shielding applications
- Can also be adapted for specific needs
Studies
of feasibility
of feasibility
MCVE Technologie has a technical team that can manufacture proofs of concept on any flexible plastic material that can be functionalized.
Our laboratory answers your requests for the manufacture of samples for the qualification of high value added plastic products.
We have the necessary equipment in our laboratory to deposit EOPROM® paste on your plastic substrates.
Do you want more information about the feasibility of your project ?
We answer quickly to all your requests.
Let’s innovate together !
INNOVATION : Heating printed on Corian©
Touch control through the material, all functions are invisible and compact
Touch control through the material, all functions are invisible and compact
NFC antennasEOPROM® paste and electrochemical Cu metallization on flexible PET
Additive lighting, customizable design
EOPROM® paste deposition and metallization then LED and SMD resistors transfer
EOPROM® paste deposition and metallization then LED and SMD resistors transfer
Generic demonstrator
EOPROM® paste and Cu metallization on flexible PPE with tin soldering
EOPROM® paste and Cu metallization on flexible PPE with tin soldering
Strain gauge integration
Complete circuit for stress verification on a thermoplastic composite
Complete circuit for stress verification on a thermoplastic composite
Deposition on glass cloth
First additive heating circuit embedded in the composite, including soldering of the connectors with tin
First additive heating circuit embedded in the composite, including soldering of the connectors with tin
INNOVATION: Heating printed in a composite
Heating function with temperature sensor monitored and controlled via WiFi on smartphone
Heating function with temperature sensor monitored and controlled via WiFi on smartphone
Shielding - Cataphoresis
Homogeneous paint deposit on both steel and plastic covered with EOPROM® paste (allows current to flow through the plastic)
Homogeneous paint deposit on both steel and plastic covered with EOPROM® paste (allows current to flow through the plastic)
