R2R (Roll to Roll) and S2S (Sheet To Sheet) processes which allow the industrial production of high-volume of additive flexible electronic circuits using EOPROM® paste.
The use of metallization baths in the EOPROMFLEX® process makes it possible to modulate the final conductivity of the material and therefore broadens the fields of application of the final product (antennas, electronic circuits, connectors, heating, electromagnetic shielding…).
We have the necessary equipment in our laboratory to deposit EOPROM® paste on your plastic substrates.
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Touch control through the material, all functions are invisible and compact
EOPROM® paste deposition and metallization then LED and SMD resistors transfer
EOPROM® paste and Cu metallization on flexible PPE with tin soldering
Complete circuit for stress verification on a thermoplastic composite
First additive heating circuit embedded in the composite, including soldering of the connectors with tin
Heating function with temperature sensor monitored and controlled via WiFi on smartphone
Homogeneous paint deposit on both steel and plastic covered with EOPROM® paste (allows current to flow through the plastic)